Nature Communications · 2023 · 40 citations · 50 references
EngineeringComputer EngineeringElectrical EngineeringMemoryMicroelectronicsSemiconductor DevicesMemory DevicesMemory HierarchyMemory Subsystem DesignMetal-oxide-semiconductor Field-effect Transistors3D Stacked MemoryChannel Conductance RegulationData-intensive ComputingEndurance OptimizationFerroelectric Field-effect TransistorsFerroelectric PropertiesMemory Array ArchitectureMemory Circuit Design
Abstract In-memory computing is an attractive alternative for handling data-intensive tasks as it employs parallel processing without the need for data transfer. Nevertheless, it necessitates a high-density memory array to effectively manage large data volumes. Here, we present a stacked ferroelectric memory array comprised of laterally gated ferroelectric field-effect transistors (LG-FeFETs). The interlocking effect of the α-In 2 Se 3 is utilized to regulate the channel conductance. Our study examined the distinctive characteristics of the LG-FeFET, such as a notably wide memory window, effective ferroelectric switching, long retention time (over 3 × 10 4 seconds), and high endurance (over 10 5 cycles). This device is also well-suited for implementing vertically stacked structures because decreasing its height can help mitigate the challenges associated with the integration process. We devised a 3D stacked structure using the LG-FeFET and verified its feasibility by performing multiply-accumulate (MAC) operations in a two-tier stacked memory configuration.
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