Integrating <scp>2D</scp> layered materials with <scp>3D</scp> bulk materials as van der Waals heterostructures for photodetections: Current status and perspectives

Abstract

Abstract In the last decade, two‐dimensional layered materials (2DLMs) have been drawing extensive attentions due to their unique properties, such as absence of surface dangling bonds, thickness‐dependent bandgap, high absorption coefficient, large specific surface area, and so on. But the high‐quality growth and transfer of wafer‐scale 2DLMs films is still a great challenge for the commercialization of pure 2DLMs‐based photodetectors. Conversely, the material growth and device fabrication technologies of three‐dimensional (3D) semiconductors photodetectors tend to be gradually matured. However, the further improvement of the photodetection performance is limited by the difficult heterogeneous integration or the inferior crystal quality via heteroepitaxy. Fortunately, 2D/3D van der Waals heterostructures (vdWH) combine the advantages of the two types of materials simultaneously, which may provide a new platform for developing high‐performance optoelectronic devices. Here, we first discuss the unique advantages of 2D/3D vdWH for the future development of photodetection field and simply introduce the structure categories, working mechanisms, and the typical fabrication methods of 2D/3D vdWH photodetector. Then, we outline the recent progress on 2D/3D vdWH‐based photodetection devices integrating 2DLMs with the traditional 3D semiconductor materials, including Si, Ge, GaAs, AlGaN, SiC, and so on. Finally, we highlight the current challenges and prospects of heterointegrating 2DLMs with traditional 3D semiconductors toward photodetection applications. image