Materials removal mechanism of single crystalline SiC with laser-induced periodic surface structures (LIPSS)

Review on copper chemical–mechanical polishing (CMP) and post-CMP cleaning in ultra large system integrated (ULSI)—An electrochemical perspective

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Investigations on continuous-wave laser and pulsed laser induced controllable ablation of SiCf/SiC composites

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Material removal mechanism of laser-assisted grinding of RB-SiC ceramics and process optimization

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Material removal mechanism of 6H-SiC studied by nano-scratching with Berkovich indenter

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Surface modulation to enhance chemical mechanical polishing performance of sliced silicon carbide Si-face

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