Binbin Meng - Concepedia

Author

Binbin Meng

Harbin Institute of Technology ORCID

Also Known As

Binbin Meng, 孟彬彬 Meng Bin-Bin

Publications

1.8K

Citations

H-Index

Concepts

All Affiliations

Harbin Institute of Technology Southern University of Science and Technology Wuhan University Soochow University

About

Binbin Meng is an author at Harbin Institute of Technology specializing in engineering, materials science, and microstructure.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	20	1.7K
2	Materials Science	17	19	1.4K
3	Mechanical Engineering	14	14	925
4	Applied Physics	12	12	1.1K
5	Materials Engineering	10	10	587

Binbin Meng

Publications

1.7K

Citations

H-Index

Page 1

	Year	Citations
Phase transition and plastic deformation mechanisms induced by self-rotating grinding of GaN single crystals Chen Li, Yinchuan Piao, Binbin Meng, International Journal of Machine Tools and Manufacture Materials ScienceSelf-rotating GrindingEngineeringSevere Plastic DeformationApplied Physics	2021	274
Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics Chen Li, Feihu Zhang, Binbin Meng, Ceramics International Sic CeramicsEngineeringPower UltrasoundMechanical EngineeringMaterial Removal Mechanism	2016	270
Molecular dynamics simulation of laser assisted grinding of GaN crystals Chen Li, Yuxiu Hu, Feihu Zhang, International Journal of Mechanical Sciences Materials ScienceAdvanced Laser ProcessingEngineeringPhysicsMaterial Simulation	2022	220
Study on strain rate and heat effect on the removal mechanism of SiC during nano-scratching process by molecular dynamics simulation Binbin Meng, Dandan Yuan, Shaolin Xu International Journal of Mechanical Sciences Materials ScienceMaterials EngineeringNanotribologyEngineeringMechanics	2018	129
Anisotropy dependence of material removal and deformation mechanisms during nanoscratch of gallium nitride single crystals on (0001) plane Chen Li, Yinchuan Piao, Binbin Meng, Applied Surface Science Materials ScienceMaterial AnalysisEngineeringCrystal Growth TechnologyDeformation Mechanisms	2021	99
Material removal mechanism of 6H-SiC studied by nano-scratching with Berkovich indenter Binbin Meng, Yong Zhang, Feihu Zhang Applied Physics A Materials ScienceMaterials EngineeringEngineeringNanoelectronicsMechanical Engineering	2016	92
Coupling effect on the removal mechanism and surface/subsurface characteristics of SiC during grinding process at the nanoscale Binbin Meng, Dandan Yuan, Shaolin Xu Ceramics International Materials ScienceMaterials EngineeringEngineeringPowder MetallurgyMaterial Processing	2018	75
Friction behavior in nanoscratching of reaction bonded silicon carbide ceramic with Berkovich and sphere indenters Feihu Zhang, Binbin Meng, Yanquan Geng, Tribology International Materials ScienceEngineeringSilicon Carbide CeramicCeramic MaterialMechanical Engineering	2016	74
Study on the machined depth when nanoscratching on 6H-SiC using Berkovich indenter: Modelling and experimental study Feihu Zhang, Binbin Meng, Yanquan Geng, Applied Surface Science Materials EngineeringMaterials ScienceEngineeringMechanical EngineeringExperimental Study	2016	73
Research of material removal and deformation mechanism for single crystal GGG (Gd 3 Ga 5 O 12 ) based on varied-depth nanoscratch testing Chen Li, Feihu Zhang, Binbin Meng, Materials & Design Materials EngineeringMaterials ScienceEngineeringGa 5Applied Physics	2017	71

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