Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits - Concepedia

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Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits

DOI Full Paper Access

15

Citations

20

References

2023

Year

Bassel Ayoub, S. Lhostis, S. Moreau, Jean‐Gabriel Mattei, Anna Mukhtarov, H. Frémont

Microelectronics Reliability

References

	Year	Citations

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