Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

Vibration Testing and Analysis of Ball Grid Array Package Solder Joints

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Engineering, Mechanical Engineering, Board Strain +18

High Speed Digital Image Correlation for Transient-Shock Reliability of Electronics

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Engineering, Failure Envelopes, Mechanical Engineering +19

Probabilistic fatigue damage estimation of embedded electronic solder joints under random vibration

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Condition Monitoring, Reliability Engineering, Engineering +9

Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach

Haiyu Qi, Michael Osterman, Michael Pecht · IEEE Transactions on Advanced Packaging · 2008 · 49 citations

Engineering, Concurrent Vibration, Mechanical Engineering +20

Combined vibration and thermal cycling fatigue analysis for SAC305 lead free solder assemblies

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