Stress analysis of automotive IGBT module under vibration load

Yanzhong Tian, Tong An, Fei Qin, Yanpeng Gong, Yanwei Dai, Yanpeng Chen

2022 23rd International Conference on Electronic Packaging Technology (ICEPT) · 2022 · 10 citations · 2 references

Concepts

Abstract

With the development of new energy vehicles, its control component (automotive IGBT module) has met new opportunities and challenges. Automotive IGBT modules are in severe service conditions and often suffer from vibration environment. Therefore, the vibration analysis of automotive IGBT module has important practical significance. In this paper, finite element software is used to study the stress distribution of automotive IGBT module under two vibration modes: simple harmonic vibration and random vibration, and a comparison is made. By observing the stress nephogram of simple harmonic vibration and random vibration, it can be found that the stress in the middle of the module and the root of the bonding wire is larger in both vibration modes.

References

2