2022 23rd International Conference on Electronic Packaging Technology (ICEPT) · 2022 · 10 citations · 2 references
EngineeringAutomotive EngineeringElectrical EngineeringAutomotive ElectronicsFinite Element AnalysisVibrationModal AnalysisStress AnalysisStress-strain BehaviorStructural VibrationVibration AnalysisVibration TestingFinite Element ModelingHarmonic VibrationHarmonic Vibration AnalysisRandom Vibration LoadsStressStress DistributionVibration ModesWire Bonding
With the development of new energy vehicles, its control component (automotive IGBT module) has met new opportunities and challenges. Automotive IGBT modules are in severe service conditions and often suffer from vibration environment. Therefore, the vibration analysis of automotive IGBT module has important practical significance. In this paper, finite element software is used to study the stress distribution of automotive IGBT module under two vibration modes: simple harmonic vibration and random vibration, and a comparison is made. By observing the stress nephogram of simple harmonic vibration and random vibration, it can be found that the stress in the middle of the module and the root of the bonding wire is larger in both vibration modes.
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