Concepedia

Yanwei Dai

YD

43

Publications

997

Citations

20

H-Index

2015

Active since

Affiliations

Beijing University of Technology(Current)

Institute of Electronics

Tsinghua University

University of South Carolina

China Electronic Product Reliability and Environmental Test Institute

Yanwei Dai is an author at Beijing University of Technology specializing in engineering, mechanical engineering, and mechanics of materials.

ORCID

Top concepts

Publications per year

2015–2024

43

Publications

43

Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process

Lixiang Zhang, Pei Chen, Tong An et al. · Current Applied Physics · 2019 · 78 citations

, , +8

Summer O3 pollution cycle characteristics and VOCs sources in a central city of Beijing-Tianjin-Hebei area, China

Yanan Guan, Xuejiao Liu, Zhiyang Zheng et al. · Environmental Pollution · 2023 · 61 citations

, , +13

A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage

Fei Qin, Xiaorui Bie, Tong An et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics · 2020 · 47 citations

, , +16

Numerical prediction based on XFEM for mixed-mode crack growth path and fatigue life under cyclic overload

Zhiying Chen, Hongchen Bao, Yanwei Dai et al. · International Journal of Fatigue · 2022 · 45 citations

, , +12

Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading

Yanwei Dai, Min Zhang, Fei Qin et al. · Engineering Fracture Mechanics · 2019 · 37 citations

, , +13

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