2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

Design and Simulation of Deep Trench Capacitor on High-Performance Silicon Interposer

Changming Song, Qian Wang, Kai Zheng et al. · 2022 · 17 citations

Engineering, Electrical Engineering, Microelectronics +16

Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application

Jiexun Yu, Yao Zheng, Shengjuan Zhou et al. · 2022 · 14 citations

Engineering, Computer Engineering, Electrical Engineering +17

Investigation on Reliability of Power Devices by Finite Element Analysis

Ruoyu Jiang, Cheng Zhong, Peng Xu et al. · 2022 · 11 citations

Engineering, Electrical Engineering, Materials Science +17

Stress analysis of automotive IGBT module under vibration load

Yanzhong Tian, Tong An, Fei Qin et al. · 2022 · 10 citations

Engineering, Automotive Engineering, Electrical Engineering +17