Simulation and Experimental Study on Metal Microstructure of Meniscus‐Confined Electrodeposition

Abstract

Meniscus‐confined electrodeposition (MCED), as one of the multifunctional additive manufacturing methods for microsensor manufacturing and flexible electrical interconnection, has great potential in future miniaturized communication devices. At present, however, the understanding of the multiphysical field processes involved in this method, such as electrodeposition, fluid dynamics, and mass and heat transfer, is limited, and the deposition forming process has not yet been well explained. Herein, the manufacturing process of metal microstructure used by MCED is studied, and the contour features of the microstructure are characterized. Simultaneously, based on the law of liquid phase mass transfer in microzone, the theoretical model of MCED process is established, the important role of Marangoni effect in evaporation process is revealed, and the effect of evaporation process on MCED is analyzed and discussed. Besides, the effect of evaporation process on the dynamic process of deposition is further proved by simulation analysis. The additive manufacturing equipment based on MCED is built to manufacture metal microstructure. Furthermore, the effects of evaporation on the morphology, roundness, vertical angle, and chemical composition of deposited metal microstructure are analyzed experimentally. These results provide a promising platform for the direct fabrication of nanocircuit interconnections, microsensors, and microantennas.