5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O

Abstract

Heterogenous co-packaging of optical I/O with compute, memory or switch nodes will deliver significant improvements in power, bandwidth and reach in data center and high-performance computing applications. A first-ever real-ized and validated 5.12 Tbps co-packaged FPGA with optical I/O is presented. The Multi-Chip Package integrates a 14nm FPGA die with five Ayar Labs TeraPHY™ optical I/O chiplets.