2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) · 2022 · 25 citations · 0 references
EngineeringComputer EngineeringHigh-performance ComputingComputer ArchitectureField-programmable Gate ArraysPhotonicsField-programmable Gate Array ArchitectureFpga ArchitectureIntegrated OpticsOptical InterconnectsPhotonic Integrated CircuitsSilicon PhotonicsChip-to-chip Optical InterconnectsCo-packaged OpticsData Center Optical InterconnectsHigh-performance Computing SystemsOptical PackagingPhotonics-to-electronics IntegrationSilicon Photonic InterconnectsSilicon Photonics Integration
Heterogenous co-packaging of optical I/O with compute, memory or switch nodes will deliver significant improvements in power, bandwidth and reach in data center and high-performance computing applications. A first-ever real-ized and validated 5.12 Tbps co-packaged FPGA with optical I/O is presented. The Multi-Chip Package integrates a 14nm FPGA die with five Ayar Labs TeraPHY™ optical I/O chiplets.