Proceedings., 39th Electronic Components Conference · 2003 · 17 citations · 0 references
EngineeringElectrical EngineeringMaterials EngineeringMicroelectronicsMicrofabricationSemiconductor DevicesChip PackagingIntegrated Circuit DesignIntegrated Circuit DevicesIntegrated Circuit FabricationInterconnect TechnologyWafer BondingBumpsDesign VerificationFabricationMultichip ModulesOn-chip InterconnectsSiliconThermal CharacteristicsThermal Transport
A multichip module process using flipped-chip interconnections is discussed. The process uses plated copper bumps for superior thermal transport characteristics, active silicon as a substrate material for matched expansion properties, and on-chip interconnection metallization that allows bumps to be placed over the active circuitry. It also makes use of conventional wafer fabrication facilities, allowing low-cost production. Details of the fabrication process are described, modeling and design verification are discussed, and a demonstration example is given.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>