Theoretical study on sawing force of ultrasonic vibration assisted diamond wire sawing (UAWS) based on abrasives wear

Diamond Wire Sawing of Solar Silicon Wafers: A Sustainable Manufacturing Alternative to Loose Abrasive Slurry Sawing

Arkadeep Kumar, Shreyes N. Melkote · Procedia Manufacturing · 2018 · 147 citations · Full text

Engineering, Manufacturing Engineering, Materials Science +17

Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed‐abrasive wire

N. Watanabe, Y. Kondo, Daisuke Ide et al. · Progress in Photovoltaics Research and Applications · 2010 · 114 citations

Engineering, Materials Engineering, Materials Science +17

Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers

Arkadeep Kumar, Steffi Kaminski, Shreyes N. Melkote et al. · Wear · 2016 · 105 citations

Engineering, Materials Engineering, Materials Science +14

Generation of diamond wire sliced wafer surface based on the distribution of diamond grits

Chunhui Chung, Le Van Nhat · International Journal of Precision Engineering and Manufacturing · 2014 · 70 citations

Engineering, Manufacturing Engineering, Materials Science +12

Distribution of diamond grains in fixed abrasive wire sawing process

Chunhui Chung, Gow Dong Tsay, Meng-Hsiu Tsai · The International Journal of Advanced Manufacturing Technology · 2014 · 66 citations

Engineering, Materials Engineering, Materials Science +6