IEEE Transactions on Semiconductor Manufacturing · 2022 · 11 citations · 21 references
ComputingComputer ScienceManufacturing EngineeringMachine LearningManufacturing SystemsTime Series AnalysisDeep LearningDefect ClassificationDefect DetectionFault DetectionFeature ExtractionTime Series Feature ExtractionAutoencodersDiagnostic Feature ExtractionFault Detection Using Deep LearningManufacturingProcess Fault DetectionSensor Data AnalyticsSputter DepositionTime Series Data Collection
Data-driven Fault Detection and Classification approaches are becoming increasingly important in semiconductor manufacturing and in other industries aiming at implementing the Zero-defect paradigm. Two of the main challenges in developing such solutions are: (i) the complexity of sensor data, that typically presents themselves in the form of time-series, requiring the employment of time-consuming and possibly sub-optimal feature extraction approaches; (ii) the fact that faults/defects may be caused by more than a single process, but in many cases they are generated by a cascade of processes. In this paper, we tackle the first issue, by considering a two-stage case study consisting of a deposition process and a rapid thermal process. The proposed approach is based on convolutional deep autoencoders employed to perform feature extraction from time-series sensor data in frontend production equipment. We will show on the reported case study, how the proposed approach outperfoms key numbers-based approaches typically used in the industry. To allow reproducibility of the reported results and to foster research in the field, we publicly share the data used in this work.
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