Publication | Closed Access

Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load

Package Interconnect Structure3D Ic ArchitectureElectrical EngineeringReliability EngineeringEngineeringHardware ReliabilityAdvanced Packaging (Semiconductors)Mechanical EngineeringNumerical SimulationSolid MechanicsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringTemperature Cyclic LoadMechanics Of MaterialsDevice Reliability