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Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip

Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Performance AnalysisMicrofabricationLiquid Metal CoolingHigh-power ChipThermal ManagementComputer EngineeringChip AttachmentElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringMicrofluidicsRefrigeration