Concepedia

Properties of high reinforcement-content aluminum matrix composite for electronic packages

Gaohui Wu, Qiang Zhang, Guoqin Chen, Longtao Jiang, Ziyang Xiu

Journal of Materials Science Materials in Electronics · 2003 · 31 citations · 3 references

DOI

Concepts

References

3

Effect of reinforcement particle size on the thermal conductivity of a particulate silicon carbide-reinforced aluminium-matrix composite

A. L. Geiger, D. P. H. Hasselman, Kimberly Y. Donaldson · Journal of Materials Science Letters · 1993 · 73 citations

, , +16

A novel lightweight microwave packaging technology

David M. Jacobson, P. Sangha · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 19 citations

, , +17

Electronic systems packaging: future reliability challenges

J. Baffett · Microelectronics Reliability · 1998 · 15 citations

, , +14