3D Integrated Laser Attach Technology on 300-mm Monolithic Silicon Photonics Platform

Abstract

A hybrid laser attach technology was demonstrated on GLOBALFOUNDRIES 300-mm monolithic silicon photonics (SiPh) platform. High accuracy bonding of laser inside a cavity in the SiPh die was accomplished. Optical power up to 10dBm was demonstrated through direct butt-coupling of the laser to SiPh die.