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Wettability, interfacial reactions, and impact strength of Sn–3.0Ag–0.5Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere

Materials ScienceMaterials EngineeringChemical EngineeringInterfacial ReactionsFormic Acid AtmosphereEngineeringSurface ScienceMetallurgical ProcessElectronic PackagingImpact Strength