EngineeringElectrical EngineeringAgingSemiconductor DevicesSensorsAge DeterminationAging AnalysisCondition MonitoringDevice CharacterizationDevice ReliabilitySemiconductor ReliabilityAging CharacterizationDegradation MonitoringGate Oxide DegradationPackaging-related DefectsPower MosfetsReliability DegradationReliability Degradation MechanismsVoltage Measurement
Harsh operating environment and high temperature swings introduce die and packaging related degradations in SiC MOSFETs causing potential system failures. This paper proposes a new SiC MOSFET state-of-health monitoring approach based on Miller plateau voltage sensing. To age the SiC devices in a short time, power cycling test is applied. During the aging process, the device's static parameters and switching transients are evaluated. From the comprehensive assessment results, the Miller plateau voltage is found to be a promising aging precursor for SiC devices. Targeting at aging detection, a practical monitoring circuit is proposed for Miller plateau voltage measurement. Experimental results reveal that the proposed method is valid for on-board SiC MOSFET aging detection during system start-up within microseconds.
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Serkan Düşmez, Manish Bhardwaj, Lei Sun et al. · IEEE Transactions on Industrial Electronics · 2016 · 55 citations
Engineering, Electrical Engineering, Condition Assessment +16
Miller plateau as an indicator of SiC MOSFET gate oxide degradation
Ze Ni, Yanchao Li, Xiaofeng Lyu et al. · 2018 · 46 citations