Concepedia

Growth behavior of intermetallic compounds on Sn-10Bi-0.7Cu-0.15Co/Co interface under multiple reflows

He Gao, Fuxiang Wei, Caixia Lin, Tie Shu, Yanwei Sui, Jiqiu Qi, Xuping Zhang

Materials Letters · 2019 · 11 citations · 14 references

DOI

Concepts

References

14

Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects

Jianfeng Li, S.H. Mannan, M.P. Clode et al. · Acta Materialia · 2006 · 227 citations

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Influences of Ag addition to Sn-58Bi solder on SnBi/Cu interfacial reaction

Fangqin Hu, Qingke Zhang, Jie Jiang et al. · Materials Letters · 2017 · 87 citations

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Contact angles by the solid-phase grain boundary wetting (coverage) in the Co–Cu system

Boris B. Straumal, Olga A. Kogtenkova, A. B. Straumal et al. · Journal of Materials Science · 2010 · 83 citations

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Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process

Hongyun Zhao, J.H. Liu, Z.L. Li et al. · Materials Letters · 2016 · 67 citations

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Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

Ying Yang, J.N. Balaraju, Yizhong Huang et al. · Acta Materialia · 2014 · 57 citations · Full text

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