Thermal ratchetting effect of AMB-AlN ceramic substrate: Experiments and calculations

Kinematic hardening rules with critical state of dynamic recovery, part I: formulation and basic features for ratchetting behavior

Nobutada OHNO, J.-D. Wang · International Journal of Plasticity · 1993 · 934 citations

Critical State, Engineering, Dynamic Constitutive Behavior +15

On the Plastic and Viscoplastic Constitutive Equations—Part I: Rules Developed With Internal Variable Concept

J.L. Chaboche, G. Rousselier · Journal of Pressure Vessel Technology · 1983 · 765 citations

Engineering, Multiscale Mechanics, Mechanical Engineering +23

Kinematic hardening model suitable for ratchetting with steady-state

Mohammad Abdel-Karim, Nobutada OHNO · International Journal of Plasticity · 2000 · 410 citations

Engineering, Dynamic Constitutive Behavior, Mechanics +6

Survey of High-Temperature Reliability of Power Electronics Packaging Components

Rabih Khazaka, L. Mendizabal, David Henry et al. · IEEE Transactions on Power Electronics · 2014 · 364 citations

Wide-bandgap Semiconductor, Engineering, Encapsulation Materials +19

Advantages and new development of direct bonded copper substrates

J. Schulz‐Harder · Microelectronics Reliability · 2003 · 157 citations

Materials Engineering, Materials Science, Engineering +6