Device Layer-Aware Analytical Placement for Analog Circuits

Abstract

The layouts of analog/mixed-signal (AMS) integrated circuits (ICs) are dramatically different from their digital counterparts. AMS circuit layouts usually include a variety of devices, including transistors, capacitors, resistors, and inductors. A complicated AMS IC system with hierarchical structure may also consist of pre-laid out subcircuits. Different types of devices can occupy different manufacturing layers. Therefore, during the layout stage, the devices require co-optimization to achieve high circuit performance. Leveraging the fact that some devices can be built by mutually exclusive layers, they can be carefully designed to overlap each other to effectively reduce the total area and wirelength without degrading the circuit performance. In this paper, we propose an analytical framework to tackle the device layer-aware analog placement problem. Experimental results show that on average the proposed techniques can reduce the total area and half-perimeter wirelength by 9% and 23%, respectively. To verify the routability of the placement results, we also develop an analog global router, which demonstrates that the device layer-aware placement can achieve 18% shorter wirelength during global routing.