Investigation of $I-V$ Linearity in TaO<sub>x</sub>-Based RRAM Devices for Neuromorphic Applications

Changhyuck Sung, Andrea Padovani, Bastien Beltrando, Donguk Lee, Myunghoon Kwak, Seokjae Lim, Luca Larcher, V. Della Marca, Hyunsang Hwang

IEEE Journal of the Electron Devices Society · 2019 · 22 citations · 25 references

DOIFull text

Open access

Concepts

Abstract

We perform experiments and device simulations to investigate the origin of current-voltage (I-V) linearity of TaO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">X</sub> -based resistive switching memory (RRAM) devices for their possible application as electronic synapses. By using electrical characterization and simulations, we link the electrical characteristics (linear or nonlinear I-V) to the microscopic properties of the conductive filament (CF). Our findings indicate that the shape and the thermal properties of the CF region are crucial to achieve linear I-V characteristics. These results allow optimizing the I-V curve linearity of TaO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">X</sub> -based RRAM devices, explaining the wide range of linear I-V characteristics experimentally observed on RRAM device obtained. When weight sum operation using SPICE simulations is performed, the read current is improved under the condition of linear I-V characteristics due to current loss minimization.

References

25