Publication | Closed Access

Failure analysis and reliability evaluation of silver-sintered die attachment for high-temperature applications

Materials ScienceReliabilityHigh-temperature ApplicationsReliability EngineeringEngineeringHardware ReliabilitySilver-sintered Die AttachmentFailure AnalysisEngineering Failure AnalysisChip AttachmentElectronic PackagingDevice ReliabilityPhysic Of Failure