Concepedia

Wengan Wang

WW

Statistics

Publications

19

Citations

800

H-Index

16

Active since

2018

Affiliations

Tsinghua University(Current)

Beihang University

State Key Laboratory of Tribology

Taiyuan University of Technology

University of Waterloo

Wengan Wang is an author at Tsinghua University specializing in engineering, materials science, and electronic packaging.

Top concepts

EngineeringMaterial ScienceElectronic PackagingSinteringApplied PhysicsMechanical EngineeringNanomaterialsMicrostructureNanotechnologyMaterials Engineering

Publications per year

2018–2023

19

Publications

19

Nacre‐Inspired, Liquid Metal‐Based Ultrasensitive Electronic Skin by Spatially Regulated Cracking Strategy

Bin Feng, Xin Jiang, Guisheng Zou et al. · Advanced Functional Materials · 2021 · 116 citations

Engineering, Electronic Skin, Material Innovation +18

Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications

Hongqiang Zhang, Wengan Wang, Hailin Bai et al. · Journal of Alloys and Compounds · 2018 · 102 citations

Materials Science, Sintering, Engineering +8

Competing Effects between Condensation and Self-Removal of Water Droplets Determine Antifrosting Performance of Superhydrophobic Surfaces

Guanlei Zhao, Guisheng Zou, Wengan Wang et al. · ACS Applied Materials & Interfaces · 2020 · 84 citations

Materials Science, Self-cleaning Surface, Chemical Engineering +14

Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging

Qiang Jia, Guisheng Zou, Wengan Wang et al. · ACS Applied Materials & Interfaces · 2020 · 60 citations

Rationally designed surface microstructural features for enhanced droplet jumping and anti-frosting performance

Guanlei Zhao, Guisheng Zou, Wengan Wang et al. · Soft Matter · 2020 · 49 citations

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