Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading

What is the Young's Modulus of Silicon?

Matthew A. Hopcroft, William D. Nix, Thomas W. Kenny · Journal of Microelectromechanical Systems · 2010 · 2K citations

Natural Sciences, Materials Science, Mechanical Engineering +17

Anisotropic Elasticity: Theory and Applications

T. C. T. Ting, Cornelius O. Horgan · Journal of Applied Mechanics · 1996 · 1.2K citations · Full text

Natural Sciences, Materials Science, Physics +17

Discussion: “Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading” (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460–466)

J. Dundurs · Journal of Applied Mechanics · 1969 · 1.1K citations · Full text

Engineering, Materials Science, Mechanical Engineering +9

Energy release rate along a three-dimensional crack front in a thermally stressed body

C.F. Shih, Brian J. Moran, Taro Nakamura · International Journal of Fracture · 1986 · 868 citations

Engineering, Materials Engineering, Mechanical Engineering +14

Discussion of Edge-Bonded Dissimilar Orthogonal Elastic Wedges under Normal and Shear Loading

J. Dundurs · Journal of Applied Mechanics-transactions of The Asme · 1969 · 680 citations

Engineering, Materials Engineering, Materials Science +14