2018 · 41 citations · 6 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesSemiconductor MaterialsHigh-frequency Semiconductor DevicesIntegrated Circuit DesignLeakage Power ReductionThermal ManagementThermal Properties Of SemiconductorsWide-bandgap Semiconductor DevicesCutoff FrequencyGate Oxide LeakageHigh-temperature Device OperationHigh-temperature ElectronicsLeakage Current ReductionThermal Management In High-frequency DevicesThermal Stress ToleranceThermal Tolerance Limits
We developed FETs having gate lengths of 25 and 60 nm that are suited for high-temperature operation, using c-axis aligned crystalline In-Ga-Zn oxide (CAAC-IGZO) as its channel material. The FETs with a gate length of 60 nm achieved off-state leakage currents of 10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-20</sup> A at 150°C. Furthermore, cutoff frequency the FETs with a gate length of 25 nm was 33 GHz at room temperature and changing the temperature from room temperature to 150°C changed the cutoff frequency by only -13% against -36% in Si FET. The CAAC-IGZO FET enables integrated circuits that consume little power even under high-temperature environments.
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Tatsuya Onuki, Wataru Uesugi, Atsuo Isobe et al. · IEEE Journal of Solid-State Circuits · 2017 · 41 citations
Engineering, Computer Engineering, Electrical Engineering +15