Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO2/Cu solder joints during the reflow process

Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates

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Natural Sciences, Materials Engineering, Materials Science +16

Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering

Ming Yang, Hongjun Ji, Shuai Wang et al. · Journal of Alloys and Compounds · 2016 · 115 citations

Natural Sciences, Materials Engineering, Materials Science +16

Application of a modified Ostwald ripening theory in coarsening of γ′ phases in Ni based single crystal superalloys

Cheng Ai, Xinbao Zhao, Jian Zhou et al. · Journal of Alloys and Compounds · 2015 · 89 citations

Natural Sciences, Materials Science, Physics +13

Microstructural modifications and properties of SiC nanoparticles-reinforced Sn–3.0Ag–0.5Cu solder alloy

A.A. El-Daly, W. M. Desoky, T.A. Elmosalami et al. · Materials & Design (1980-2015) · 2014 · 88 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu solders

Zhaolong Ma, S. Belyakov, C.M. Gourlay · Journal of Alloys and Compounds · 2016 · 88 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +14