Interfacial Bond Formation

Interficial Bond Formation is a metallurgical process in ultrasonic welding whereby the intimate contact and relative motion of two surfaces induce plastic deformation, oxide layer disruption, and atomic diffusion, resulting in a solid-state weld at the interface.

376

Publications

16.7K

Citations

1.5K

Authors

468

Institutions

Publications per year

2017–2026

193

Authors

1.5K

  1. DY
    Doo‐Yeol Yoo

    Hanyang University, South Korea

    5 publications · 269 citations

    6

    h-index

  2. TM
    Thong M. Pham

    Curtin University, Australia

    4 publications · 129 citations

    4

    h-index

  3. JY
    Jiuchun Yan

    Harbin Institute of Technology, China

    4 publications · 162 citations

    4

    h-index

  4. TK
    Toshihiko Koseki

    The University of Tokyo, Japan

    4 publications · 72 citations

    4

    h-index

  5. WC
    Wensu Chen

    Curtin University, Australia

    4 publications · 129 citations

    4

    h-index

1–5 of 1.5K

Venues

  1. Construction and Building Materials

    19 publications · 932 citations

    17

    h-index

  2. Materials Science and Engineering A

    10 publications · 550 citations

    10

    h-index

  3. Journal of Manufacturing Processes

    JMP · 9 publications · 427 citations

    10

    h-index

  4. Science and Technology of Welding & Joining

    9 publications · 356 citations

    9

    h-index

  5. Applied Surface Science

    9 publications · 303 citations

    9

    h-index

1–5