Interfacial Bond Formation
Interficial Bond Formation is a metallurgical process in ultrasonic welding whereby the intimate contact and relative motion of two surfaces induce plastic deformation, oxide layer disruption, and atomic diffusion, resulting in a solid-state weld at the interface.
376
Publications
16.7K
Citations
1.5K
Authors
468
Institutions
Publications per year
2017–2026
193
Parents
376
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Harbin Institute of Technology
Harbin, China
16 h-index
69 publications
3.2K citations

Chinese Academy of Sciences
Beijing, China
10 h-index
35 publications
1.2K citations
Wuhan University of Technology
Wuhan, China
8 h-index
28 publications
652 citations

Southeast University
Nanjing, China
7 h-index
10 publications
257 citations
Tianjin University
Tianjin, China
6 h-index
13 publications
427 citations

Beijing University of Technology
Beijing, China
6 h-index
20 publications
701 citations
Dalian University of Technology
Dalian, China
6 h-index
23 publications
842 citations
Tongji University
Shanghai, China
6 h-index
10 publications
326 citations
1–8 of 468
19 publications · 932 citations
17
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10 publications · 550 citations
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JMP · 9 publications · 427 citations
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9 publications · 356 citations
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9 publications · 303 citations
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