ECS Transactions · 2018 · 14 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceOptoelectronicsPhotonicsSemiconductor DevicesIntegrated Circuit DesignIntegrated PhotonicsOptoelectronic DevicesPhotonic Integrated CircuitsSemiconductor HeterostructuresSilicon PhotonicsBondingDie-to-wafer BondingIntegrated Photonic DevicesIntegration Of Iii-v MaterialsPlacement Precision EvaluationSiliconSilicon Photonics IntegrationThroughput
Optoelectronic devices usually needs heterostructure integration with III/V devices integrated on silicon circuits. As throughput placement are more important than placement precision, collective die to wafer bonding is an interesting process for these applications. Moreover as light should be propagated through the bonding interface, minimizing the interfacial material is mandatory. Collective direct bonding of die to wafer is then proposed. The bonding yield as well as the first placement accuracy is evaluated.