Chemical compatibility of fused filament fabrication-based 3-D printed components with solutions commonly used in semiconductor wet processing - Concepedia

Concepedia

Publication | Open Access

Chemical compatibility of fused filament fabrication-based 3-D printed components with solutions commonly used in semiconductor wet processing

DOI Full Paper Access

76

Citations

42

References

2018

Year

Ismo T. S. Heikkinen, Christoffer Kauppinen, Zhengjun Liu, Sanja Asikainen, Steven Spoljaric, Jukka Seppälä, Hele Savin, Joshua M. Pearce

Additive manufacturing

Materials ScienceChemical CompatibilityChemical EngineeringEngineeringFlexible ElectronicsMicrofabricationFabrication TechniquePrinted ElectronicsAdvanced ManufacturingProcessing And ManufacturingElectronic Packaging3D PrintingSemiconductor Wet Processing

References

	Year	Citations

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