Publication | Closed Access
Thermal performance analysis of a microchannel heat sink cooling with copper oxide-indium (CuO/In) nano-suspensions at high-temperatures
110
Citations
50
References
2018
Year
Materials ScienceEngineeringLiquid Metal CoolingNanomaterialsMicrofabricationHeat ExchangerHeat Transfer EnhancementThermal ManagementThermodynamicsHeat TransferThermal Performance AnalysisMicrofluidicsThermal EngineeringCopper Oxide-indiumMicrochannel Heat Sink
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