J. A. Eastman - Concepedia

Author

J. A. Eastman

Also Known As

Eastman, J. A., Eastman, J.A., Eastman, Jeffrey A., Eastman, Jeffrey A.; Thompson, Loren J., Eastman, Jeffrey A.; Veal, Boyd W.; Zapol, Peter, Eastman,J, J A Eastman, J Eastman, J. A. Eastman, J. EASTMAN

230

Publications

22.9K

Citations

H-Index

103

Concepts

All Affiliations

Argonne National Laboratory Northern Illinois University Northwestern University University of California, Santa Barbara Los Alamos National Laboratory

About

J. A. Eastman is an author at Argonne National Laboratory specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	44	91	20.4K
2	Applied Physics	40	72	18.6K
3	Chemistry	13	14	5.1K
4	Natural Sciences	11	11	859
5	Chemical Engineering	5	5	3.4K

J. A. Eastman

100

Publications

20.8K

Citations

H-Index

Page 1

	Year	Citations
Anomalously increased effective thermal conductivities of ethylene glycol-based nanofluids containing copper nanoparticles J. A. Eastman, Soo-Chang Choi, Shuai Li, Applied Physics Letters Ethylene GlycolEngineeringDispersed Oxide NanoparticlesCopper NanoparticlesChemistry	2001	3.9K
Measuring Thermal Conductivity of Fluids Containing Oxide Nanoparticles S. Lee, Soo-Chang Choi, Shuai Li, Journal of Heat Transfer Materials ScienceChemical EngineeringEngineeringNanomaterialsNanotechnology	1999	3K
Mechanisms of heat flow in suspensions of nano-sized particles (nanofluids) Pawel Keblinski, Simon R. Phillpot, Soo-Chang Choi, International Journal of Heat and Mass Transfer EngineeringFluid MechanicsApplied PhysicsHeat FlowMicrorheology	2002	2.2K
Ferroelectricity in Ultrathin Perovskite Films Dillon D. Fong, G. B. Stephenson, S. K. Streiffer, Science Materials ScienceLead-free PerovskitesPerovskite Thin FilmsEngineeringFerroelectric Application	2004	1.3K
Enhanced Thermal Conductivity through the Development of Nanofluids J. A. Eastman, Ung-Kyu Choi, Shuai Li, MRS Proceedings Materials ScienceEnhanced Thermal ConductivityEngineeringNanomaterialsNanotechnology	1996	1.1K
Nanofluids for thermal transport Pawel Keblinski, J. A. Eastman, David G. Cahill Materials Today Materials ScienceEngineeringFluid SuspensionsThermal TransportApplied Physics	2005	903
Elastic and tensile behavior of nanocrystalline copper and palladium Paul G. Sanders, J. A. Eastman, J. Weertman Acta Materialia Materials ScienceEngineeringSevere Plastic DeformationMechanical PropertiesMechanical Engineering	1997	849
THERMAL TRANSPORT IN NANOFLUIDS J. A. Eastman, Simon R. Phillpot, Soo-Chang Choi, Annual Review of Materials Research Materials ScienceHeat Transfer ProcessEngineering▪ Abstract NanofluidsNanomaterials	2004	834
Effect of liquid layering at the liquid–solid interface on thermal transport Li‐Ping Xue, Pawel Keblinski, Simon R. Phillpot, International Journal of Heat and Mass Transfer Materials ScienceLiquid–solid InterfaceEngineeringThermal TransportApplied Physics	2004	488
Rapid stress-driven grain coarsening in nanocrystalline Cu at ambient and cryogenic temperatures Kai Zhang, J. Weertman, J. A. Eastman Applied Physics Letters Cryogenic TemperaturesEngineeringSevere Plastic DeformationMechanical EngineeringCold Working	2005	375

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