Publication | Closed Access
Progress and future challenges of SiC power devices and process technology
24
Citations
11
References
2017
Year
Unknown Venue
Sic Device PhysicsEngineeringFuture ChallengesPower DevicesSic Power DevicesPower Electronic SystemsPower ElectronicsSemiconductor DeviceHigh Voltage EngineeringRecent ProgressPower SemiconductorsPower Electronic DevicesSemiconductor TechnologyElectrical EngineeringPower Semiconductor DeviceSingle Event EffectsSemiconductor Device FabricationMicroelectronicsSic MosfetsPower DeviceApplied PhysicsTechnologyCarbideProcess Technology
Recent progress in SiC device physics and development of power devices in the authors' group is reviewed. The impact ionization coefficients in the wide temperature range were determined, which enables accurate device simulation. 13 kV SiC pin diodes with a very low differential on-resistance of 1.4 mΩ.cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and 11 kV SiC epitaxial MPS diodes are presented. A mobility-limiting factor in SiC MOSFETs is discussed, and 3 kV reverse-blocking MOSFETs are demonstrated.
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