On the relationships between plasma chemistry, etching kinetics and etching residues in CF4+C4F8+Ar and CF4+CH2F2+Ar plasmas with various CF4/C4F8 and CF4/CH2F2 mixing ratios - Concepedia

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On the relationships between plasma chemistry, etching kinetics and etching residues in CF4+C4F8+Ar and CF4+CH2F2+Ar plasmas with various CF4/C4F8 and CF4/CH2F2 mixing ratios

35

Citations

31

References

2017

Year

Jaemin Lee, Alexander Efremov, Kwang‐Ho Kwon

Chemical EngineeringEngineeringVarious Cf4/c4f8ChemistryNonthermal PlasmaPlasma ApplicationPlasma EtchingChemical Kinetics

References

	Year	Citations

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