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Publication | Open Access

Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module

DOIFull Paper Access

11

Citations

10

References

2017

Year

Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young Ho Ko, Jeong‐Won Yoon, Chang‐Woo Lee, Young-Bae Park, Junghwan Bang
Journal of Welding and Joining

Abstract

1. , , , , , , 1) . Si 150 180~230 Pb , Sn-Cu-Ag 2,3) . SiC , SiC

References

YearCitations

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