IEEE Journal of Solid-State Circuits · 2017 · 119 citations · 17 references
EngineeringComputer EngineeringElectrical EngineeringComputer ArchitectureMicroelectronicsSemiconductor DevicesMemory DevicesMemory HierarchyMemory Subsystem Design3D Nand Architecture3D Stacked MemoryAnnealingAnnealing EffectsData LoadingMemory Circuit DesignNand Flash MemoryTraps
A 64-word-line-stacked 512-Gb 3-b/cell 3-D NAND flash memory is presented. After briefly examining the challenges that occur to a stack, several technologies are suggested to resolve the issues. For performance enhancement, a novel program method hiding two-page data loading time is presented. This paper also discusses an electrical annealing improving reliability characteristic by removing holes in shallow traps. In addition, a valley tracking read for reducing timing overhead at a read retry is introduced by fast finding optimal read levels. Finally, a high-speed self-test mode for IO operation is presented. The chip, designed with the fourth generation of V-NAND technology, achieved an areal density of 3.98 Gb/mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and operated up to 1 Gb/s at 1.2 V.
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A 128 Gb 3b/cell V-NAND Flash Memory With 1 Gb/s I/O Rate
Woopyo Jeong, Jae-Woo Im, Doo-Hyun Kim et al. · IEEE Journal of Solid-State Circuits · 2015 · 98 citations