2017 · 14 citations · 0 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsMicrowave EngineeringThin FilmsDevice ReliabilityMems PackagingMems ReliabilityMems SwitchesMicrowave PackagingRf MemsMicrowave SwitchesPackaging-induced ReliabilityRadio-frequency PackagingRedundancy SchemesRf Mems PackagingRf Mems ReliabilityRf Mems SwitchesWire Bonding
A low cost packaging solution has been successfully implemented on RF MEMS switches. The encapsulation is made at wafer level by thin film packaging, it allows keeping very small footprint for the device and is fully compatible with wire bonding and flip chip assembly. In addition to their highly shrinked size, packaged switches excellent microwave performances and promising behaviors in terms of reliability, especially for redundancy schemes required by space applications.