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Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests

Materials ScienceEngineeringMechanical PropertiesMechanical BehaviorMechanical EngineeringStrain DistributionMicrostructure-strength RelationshipCrack FormationSn Grain OrientationLow-cycle FatigueMechanics Of MaterialsMicrostructureThermal Cycling Tests