Concepedia

Publication | Closed Access

Analysis of Cu/low-k bond pad delamination by using a novel failure index

DOI

43

Citations

13

References

2006

Year

M.A.J. van Gils, O. van der Sluis, G.Q. Zhang, J.H.J. Janssen, R.M.J. Voncken
Microelectronics Reliability

References

YearCitations

Page 1