R.M.J. Voncken

Analysis of Cu/low-k bond pad delamination by using a novel failure index

M.A.J. van Gils, O. van der Sluis, G.Q. Zhang et al. · Microelectronics Reliability · 2006 · 43 citations

Materials Science, Materials Engineering, Electrical Engineering +7

Simulation of arterial dissection by a penetrating external body using cohesive zone modelling

Christopher Noble, O. van der Sluis, R.M.J. Voncken et al. · Journal of the mechanical behavior of biomedical materials/Journal of mechanical behavior of biomedical materials · 2017 · 19 citations · Full text

Engineering, Vascular Trauma, Surgery +25

Analysis of cu/low-k bond pad delainination by using a novel failure index

M.A.J. van Gils, O. van der Sluis, G.Q. Zhang et al. · 2005 · 13 citations

Engineering, Mechanical Engineering, Defect Tolerance +19

FlexMM: A standard method for material descriptions in FEM

Manso Groen, Soheil Solhjoo, R.M.J. Voncken et al. · Advances in Engineering Software · 2020 · 11 citations · Full text