IEEE Electron Device Letters · 2017 · 67 citations · 16 references
EngineeringElectrical EngineeringMaterials ScienceMicroelectronicsSemiconductor DevicesThin FilmsAmorphous SemiconductorsHigh-frequency Semiconductor DevicesMetal-oxide-semiconductor Field-effect TransistorsSemiconductor Device MaterialsSemiconductor Thin FilmsThin-film TransistorsAmorphous Indium Gallium Zinc OxideAmorphous Oxide SemiconductorsMagnetron SputteringOxide Thin-film TransistorsPassivationSemiconductor Oxide Thin FilmsSputteringThin Oxide Films
This letter demonstrates a high-mobility amorphous indium-gallium-zinc oxide (a-IGZO) thin-film transistor (TFT) with aluminum oxide (Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> ) passivation layer by radio frequency (RF) magnetron sputtering and copper (Cu) source/drain electrodes. The fabricated a-IGZO TFT exhibited 20 times higher saturation mobility (142.0 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /Vs) than the reference device without Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> passivation layer. The generation of metallic indium at the back-channel interface caused by the bombardment of the sputtered Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> is the main principle for the remarkable enhancement of saturation mobility. Furthermore, the a-IGZO TFT maintains high mobility and air-ambient-stable characteristics up to four months in ambient conditions.
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