Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application - Concepedia

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Thermal, mechanical and dielectric properties of flexible BN foam and BN nanosheets reinforced polymer composites for electronic packaging application

190

Citations

39

References

2017

Year

Haoming Fang, Shu‐Lin Bai, C.P. Wong

Composites Part A Applied Science and Manufacturing

Materials ScienceFlexible Bn FoamDielectric PropertiesEngineeringFlexible ElectronicsBn NanosheetsMechanical EngineeringComposite TechnologyHigh-performance MaterialPolymer CompositesElectronic PackagingThermoplastic CompositeNanocompositeFoam

References

	Year	Citations

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