Interposer Technologies for High-Performance Applications

Abstract

This paper explores the current state of the art in silicon, organic, and glass interposer technologies and their high-performance applications. Issues and challenges broadly encompassing electrical, mechanical, and thermal properties of these interposer technologies are discussed along with the proven and under research solutions pertaining to these challenges. An evaluation of high-performance applications for these three technologies provides a useful insight into the role of interposers for such applications. This paper is an effort to evaluate and compare the viability of silicon, organic, and glass interposer technologies for high-performance applications. This paper also discusses the future trends, promising advancements, and market requirements with special emphasis on glass interposer technologies as evaluated to be the most viable option for the future high-performance applications.