Grain structure modification of Cu-Sn IMCs by applying Cu-Zn UBM on transient liquid-phase bonding in novel 3D-IC technologies

Kinetic theory of flux-driven ripening

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Total Surface Area, Engineering, Physics +14

Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

Hua Zou, H.J. Yang, Z.F. Zhang · Acta Materialia · 2008 · 200 citations

Materials Science, Materials Engineering, Engineering +9

Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing

Feng Gao, Tatsuya Takemoto, Hiroshi Nishikawa · Materials Science and Engineering A · 2006 · 194 citations

Materials Engineering, Materials Science, Reactive Diffusion +7

The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7Cu/Cu solder joints

Guang Zeng, Stuart D. McDonald, Qinfen Gu et al. · Acta Materialia · 2014 · 162 citations

Materials Science, Materials Engineering, Engineering +7

Thermodynamic reevaluation of the Cu-Zn system

Markus Kowalski, P.J. Spencer · Journal of Phase Equilibria · 1993 · 122 citations

Thermodynamic Modelling, Cu-zn System, Engineering +6