Effects of microstructure and intergranular glassy phases on thermal conductivity of silicon nitride

References

Page 1

	Year	Citations
Heat transport in thin dielectric films Seung Min Lee, David G. Cahill Journal of Applied Physics Thin Film PhysicsEngineeringThin Film Process TechnologyPecvd Sinx FilmsThermal Conductivity	1997	706
State of the art of high temperature power electronics Cyril Buttay, Dominique Planson, Bruno Allard, Materials Science and Engineering B High-power ElectronicsElectrical EngineeringEngineeringPower DevicePower Electronic Systems	2010	398
Effective thermal conductivity of a misoriented short fiber composite Hiroshi Hatta, Minoru Taya Journal of Applied Physics Materials ScienceEngineeringMechanical EngineeringThermal PropertySteady-state Heat Conduction	1985	376
A Tough Silicon Nitride Ceramic with High Thermal Conductivity You Zhou, Hideki Hyuga, Dai Kusano, Advanced Materials Materials ScienceMaterials EngineeringHigh Thermal ConductivityEngineeringCeramics	2011	309
Thermal Conductivity of β‐Si <sub>3</sub> N <sub>4</sub> : II, Effect of Lattice Oxygen Mikito Kitayama, Kiyoshi Hirao, A. Tsuge, Journal of the American Ceramic Society	2000	214
Thermal Conductivity of ß‐Si3N4: I, Effects of Various Microstructural Factors Mikito Kitayama, Kiyoshi Hirao, Motohiro Toriyama, Journal of the American Ceramic Society Materials ScienceIncreased Grain SizeHigh Temperature MaterialsEngineeringGrain Growth	1999	187
Design for reliability of power electronics modules Hua Lu, C. Bailey, Chunyan Yin Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability	2009	182
MgSiN <sub>2</sub> Addition as a Means of Increasing the Thermal Conductivity of β‐Silicon Nitride Hiroyuki Hayashi, Kiyoshi Hirao, Motohiro Toriyama, Journal of the American Ceramic Society	2001	163
Effect of Grain Growth of β‐Silicon Nitride on Strength, Weibull Modulus, and Fracture Toughness Naoto Hirosaki, Yoshio Akimune, Mamoru Mitomo Journal of the American Ceramic Society Exaggerated Grain GrowthEngineeringMechanical EngineeringPowder CompactionCeramic Powders	1993	162
Microstructure and Fracture Toughness of Si <sub>3</sub> N <sub>4</sub> Ceramics: Combined Roles of Grain Morphology and Secondary Phase Chemistry Hans‐Joachim Kleebe, Giuseppe Pezzotti, Günter Ziegler Journal of the American Ceramic Society	1999	154

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