IEEE Transactions on Nuclear Science · 2016 · 75 citations · 24 references
EngineeringElectrical EngineeringMicroelectronicsRadiation PhysicsSemiconductor DevicesAbsorbed DoseDevice ModelingHigh-dose Radiation EffectsRadiation HardeningHardnessIrradiation ConditionsLeakageRadiation EffectsRadiation HardnessRadiation-hard DevicesRadiation-induced Leakage CurrentThreshold Voltage
Total ionizing dose results are provided, showing the effects of different threshold adjust implant processes and irradiation bias conditions of 14-nm FinFETs. Minimal radiation-induced threshold voltage shift across a variety of transistor types is observed. Off-state leakage current of nMOSFET transistors exhibits a strong gate bias dependence, indicating electrostatic gate control of the sub-fin region and the corresponding parasitic conduction path are the largest concern for radiation hardness in FinFET technology. The high- <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\textit {th}}$ </tex-math></inline-formula> transistors exhibit the best irradiation performance across all bias conditions, showing a reasonably small change in off-state leakage current and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\textit {th}}$ </tex-math></inline-formula> , while the low- <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\textit {th}}$ </tex-math></inline-formula> transistors exhibit a larger change in off-state leakage current. The “ worst-case” bias condition during irradiation for both pull-down and pass-gate nMOSFETs in static random access memory is determined to be the on-state ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\textit {gs}}=V_{\textit {dd}}$ </tex-math></inline-formula> ). We find the nMOSFET pull-down and pass-gate transistors of the SRAM bit-cell show less radiation-induced degradation due to transistor geometry and channel doping differences than the low- <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$V_{\textit {th}}$ </tex-math></inline-formula> transistor. Near-threshold operation is presented as a methodology for reducing radiation-induced increases in off-state device leakage current. In a 14-nm FinFET technology, the modeling indicates devices with high channel stop doping show the most robust response to TID allowing stable operation of ring oscillators and the SRAM bit-cell with minimal shift in critical operating characteristics.
24
FinFET scaling to 10 nm gate length
Bin Yu, Leland Chang, Safayet Ahmed et al. · 2003 · 595 citations