Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.3K citations

Reliability, Electrical Engineering, Reliability Engineering +10

Smithells metals reference book

Choice Reviews Online · 1993 · 839 citations

Materials Science, Metallurgical System

Highly efficient low-voltage cathodoluminescence of LaF₃:Ln[sup 3+] (Ln=Eu[sup 3+], Ce[sup 3+], Tb[sup 3+]) spherical particles

Zhenling Wang, H.L.W. Chan, Hiuling Li et al. · PolyU Institutional Research Archive (Hong Kong Polytechnic University) · 2008 · 383 citations · Full text

Optical Materials, Engineering, Physics +7

Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions

K. N. Tu · Physical review. B, Condensed matter · 1994 · 353 citations

Engineering, Severe Plastic Deformation, Chemistry +20

Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits

W. J. Boettinger, C. E. Johnson, L.A. Bendersky et al. · Acta Materialia · 2005 · 320 citations

Materials Science, Engineering, Surface Electrochemistry +6