Publication | Closed Access
Removal rate and surface quality of the GLSI silicon substrate during the CMP process
33
Citations
11
References
2016
Year
Materials ScienceMaterials EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationRemoval RateSurface ScienceApplied PhysicsGlsi Silicon SubstrateCmp ProcessSemiconductor Device FabricationElectronic PackagingSilicon On InsulatorMicroelectronicsSurface Processing
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